The Micro and Nanomechatronic Systems Lab at the University of Technology Sydney (UTS), within the Centre for Audio, Acoustics and Vibration (CAAV), leads research at the frontier of micro- and nanoscale engineering, precision instrumentation, and intelligent control. Our expertise spans the design, fabrication, and control of precision mechatronic systems, with a focus on microelectromechanical systems (MEMS), including ultrasonic and acoustic devices and radiofrequency MEMS acoustic resonators. By combining capabilities in micro/nanofabrication, advanced semiconductor packaging, control theory, and physical computation, we develop next-generation platforms that extend the limits of sensing, actuation, and system integration.
Our research underpins transformative applications in high-throughput nanometrology using atomic force microscopy (AFM) and tip-enhanced Raman spectroscopy (TERS), alongside innovations in ultra-low power sensors, microactuation, and novel semiconductor materials. Bridging fundamental science and precision engineering with real-world impact, the lab creates scalable technologies to drive scientific discovery, advanced manufacturing, and the development of next-generation micro- and nanosystems.
CONTACT US
Lab Lead: Dr. Dipl.-Ing. Michael Ruppert
Contact Us: Michael.ruppert@uts.edu.au
Equipment
- Polytec MSA-100-3D 25MHz Laser Doppler Vibrometer
- Nanosurf DriveAFM
- Zurich Instruments HF2LI 50MHz Lock-in Amplifier
- Zurich Instruments MFIA 5MHz Impedance Analyzer
- MEMS Coaxial CV/IV Probe Station
- DSpace MicroLabBox II Rapid Controller Prototyping System
- Speciality low-noise amplifiers and instrumentation equipment
- Optical Microscopes
- Newport Optical Isolation Tables
Capabilities
The Micro and Nanomechatronic Systems Lab offers advanced experimental and prototyping capabilities to support both fundamental research and industry collaboration. With state-of-the-art measurement, fabrication, and control infrastructure, we provide unique expertise in precision characterisation, system integration, and application-driven innovation at the micro and nanoscale.
- High-precision dynamic and acoustic measurements – Using a Polytec MSA-100-3D 25 MHz Laser Doppler Vibrometer, we perform full-field vibration analysis of MEMS, ultrasonic devices, and precision mechatronic systems. This enables academic and industry partners to evaluate reliability, performance, and dynamic behaviour of novel micro components.
- Nanometrology and surface analysis – Our Nanosurf DriveAFM allows atomic-scale imaging in ambient and liquid environments, spectroscopy, and nanomechanical measurements. Combined with tip-enhanced Raman spectroscopy (TERS) and optical microscopy, we provide insights into material properties critical for electronics, sensors, coatings, and nanofabrication.
- Electronic interface design and assembly – With in-house JBC precision micro soldering stations and wirebonding capability, we design and assemble custom electronic interfaces for MEMS, microsensors, and prototype systems. This accelerates the integration of devices into functional test setups and shortens development cycles for industry partners.
- Electrical and impedance characterisation – With Zurich Instruments MFIA 5 MHz Impedance Analyzer, HF2LI 50MHz Lock-in Amplifier, and a MEMS coaxial CV/IV probe station, we deliver advanced analysis of capacitive, resistive, and dynamic behaviours in microdevices, sensors, and novel materials.
- Real-time system prototyping and control – Our dSPACE MicroLabBox II and FPGA prototyping systems enable rapid prototyping of high-speed advanced control algorithms, allowing fast transition from simulation to hardware-in-the-loop testing for actuators, smart materials, and robotics.
- Low-noise signal detection and instrumentation – Speciality amplifiers and optical isolation tables ensure accurate measurements even in demanding environments, providing industry with reliable data for device development and characterization.
Together, these capabilities position the lab as a partner for industry projects in advanced sensing and actuation, precision manufacturing, ultrasonic and acoustic devices, semiconductor testing, and next-generation instrumentation development.